Networking Equipment Lower Enclosures (OEM / ODM)

Custom injection-molded networking equipment lower enclosures for OEM and ODM projects. The G-30~G31 series illustrates our experience in tooling, molding and assembly for this application. We review component geometry, material selection and assembly interfaces against your drawings or samples. Colors, surface markings, hardware and secondary processing can be discussed as part of the manufacturing plan.

Suggested resins include ABS, PC+ABS. Final material grade is selected according to your drawings, application and required specifications.

Electronic and electromechanical equipment housings, mounting structures and precision assemblies.

Electronic and electromechanical equipment housings, mounting structures and precision assemblies.

Dimensions, weight, tolerances and production quantities are confirmed against customer drawings and approved samples. Custom colors and printing are available subject to project evaluation. Final production specifications are based on the approved DFM drawings, first samples and customer confirmation.

Please contact us with your drawings or samples, material requirements and estimated quantity for a manufacturing evaluation.